- Type：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Condiciones seleccionadas:
Descubre los productos 9
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
6,500
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220
|
Top Mount | SMD Pad | TO-263 (D2Pak) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
6,648
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220
|
Top Mount | SMD Pad | TO-263 (D2Pak) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
6,648
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220
|
Top Mount | SMD Pad | TO-263 (D2Pak) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
12,216
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
TOP MOUNT HEATSINK .45" D2PAK
|
Top Mount | SMD Pad | TO-263 (D2Pak) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | ||
|
|
|
CUI Inc. |
1,950
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, STAMPING, TO-263, 19.
|
Board Level | - | TO-220 | 3.8W @ 75°C | 5.50°C/W @ 200 LFM | 21.90°C/W | ||
|
|
|
CUI Inc. |
2,094
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, STAMPING, TO-263, 19.
|
Board Level | - | TO-220 | 3.8W @ 75°C | 5.50°C/W @ 200 LFM | 21.90°C/W | ||
|
|
|
CUI Inc. |
2,094
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, STAMPING, TO-263, 19.
|
Board Level | - | TO-220 | 3.8W @ 75°C | 5.50°C/W @ 200 LFM | 21.90°C/W | ||
|
|
|
ASSMANN WSW Components |
626
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 19.38X25.40MM
|
Top Mount | SMD Pad | TO-263 (D2Pak) | - | - | 23.00°C/W | ||
|
|
|
Comair Rotron |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 19.4X25.4X11.4MM
|
Board Level | SMD Pad | TO-263 (D2Pak) | 1.5W @ 20°C | 4.00°C/W @ 200 LFM | - |
