834000T00000

Attachment Method :

SMD Pad

Diameter :

-

Height Off Base (Height of Fin) :

0.450" (11.43mm)

Length :

0.763" (19.38mm)

Material :

Copper

Material Finish :

Tin

Package Cooled :

TO-263 (D2Pak)

Power Dissipation @ Temperature Rise :

1.5W @ 20°C

Series :

-

Shape :

Rectangular, Fins

Thermal Resistance @ Forced Air Flow :

4.00°C/W @ 200 LFM

Thermal Resistance @ Natural :

-

Type :

Board Level

Width :

1.000" (25.40mm)