- Material：
-
- Length：
-
- Width：
-
- Diameter：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Condiciones seleccionadas:
Descubre los productos 43
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
12,250
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
|
- | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
12,300
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
|
- | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
12,300
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
|
- | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
16,283
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
TOP MOUNT HEATSINK .4" D2PAK
|
- | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 1.3W @ 30°C | 8.00°C/W @ 300 LFM | 18.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
9,699
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
TOP MOUNT HEATSINK .4" D-PAK
|
- | Top Mount | Copper | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | SMD Pad | TO-252 (DPAK) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
4,750
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK SMT D-PAK/TO-252 TIN
|
- | Top Mount | Copper | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | SMD Pad | TO-252 (DPAK) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
4,764
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK SMT D-PAK/TO-252 TIN
|
- | Top Mount | Copper | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | SMD Pad | TO-252 (DPAK) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||
|
|
|
Ohmite |
9,471
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-263 BLACK
|
D | Top Mount | Aluminum | Rectangular, Fins | 0.500" (12.70mm) | 1.020" (25.91mm) | - | Solderable Feet | TO-263 (D2Pak) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
9,436
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-5 .4" BLK
|
- | Top Mount | Aluminum | Cylindrical | - | - | 0.315" (8.00mm) ID, 0.750" (19.05mm) OD | Press Fit | TO-5 | 0.5W @ 30°C | 15.00°C/W @ 400 LFM | 56.00°C/W | Black Anodized | ||
|
|
|
Ohmite |
3,336
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-263
|
D | Top Mount | Aluminum | Rectangular, Fins | 0.500" (12.70mm) | 1.020" (25.91mm) | - | Solderable Feet | TO-263 (D2Pak) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Degreased | ||
|
|
|
Wakefield-Vette |
4,209
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 100PQFP COMPOSITE
|
Deltem | Top Mount | Composite | Square, Pin Fins | 0.650" (16.51mm) | 0.650" (16.51mm) | - | Thermal Tape, Adhesive (Not Included) | BGA | 2.0W @ 40°C | 25.00°C/W @ 350 LFM | - | - | ||
|
|
|
Wakefield-Vette |
900
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 128PQFP COMPOSITE
|
Deltem | Top Mount | Composite | Square, Pin Fins | 0.850" (21.59mm) | 0.850" (21.59mm) | - | Thermal Tape, Adhesive (Not Included) | BGA | 2.5W @ 90°C | 20.00°C/W @ 100 LFM | - | - | ||
|
|
|
Ohmite |
1,763
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-268 BLACK
|
D | Top Mount | Aluminum | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | Solderable Feet | TO-268 | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
1,458
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TRIPLE TO-126 COPPER
|
- | Board Level, Vertical | Copper | Rectangular, Fins | 1.759" (44.68mm) | 1.750" (44.45mm) | - | Clip and Board Mounts | TO-126 | - | 6.50°C/W @ 200 LFM | 15.00°C/W | Tin | |||
|
|
Advanced Thermal Solutions Inc. |
938
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-252 D-PAK COPPER
|
- | Top Mount | Copper | Rectangular, Fins | 0.315" (8.00mm) | 0.842" (21.40mm) | - | - | TO-252 (DPAK) | - | 21.00°C/W @ 200 LFM | 28.00°C/W | Tin | |||
|
|
|
Wakefield-Vette |
562
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 43MM SQ BLK H=.4"
|
628 | Top Mount | Aluminum | Square, Pin Fins | 1.750" (44.45mm) | 1.700" (43.18mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 2.5W @ 30°C | 4.00°C/W @ 300 LFM | - | Black Anodized | ||
|
|
|
Apex Microtechnology |
12
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR DK AND HQ PACKAGES
|
Apex Precision Power | Board Level | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 0.400" (10.16mm) | - | Bolt On | - | - | - | 16.00°C/W | - | ||
|
|
|
Apex Microtechnology |
31
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK SMT
|
Apex Precision Power | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | SMD Pad | SMD | - | 16.00°C/W @ 600 LFM | 50.00°C/W | Solderable | ||
|
|
|
Ohmite |
5
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-268
|
D | Top Mount | Aluminum | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | Solderable Feet | TO-268 | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Degreased | ||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO220 HOR MNT W/TAB
|
- | Board Level | Aluminum | Rectangular, Fins | 0.742" (18.85mm) | 0.860" (21.84mm) | - | Bolt On | TO-220 | - | 11.00°C/W @ 200 LFM | 23.20°C/W | Black Anodized |
