- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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Descubre los productos 6
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Width | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Width | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
9,699
|
3 dias |
-
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MOQ: 1 MPQ: 1
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TOP MOUNT HEATSINK .4" D-PAK
|
0.900" (22.86mm) | SMD Pad | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
4,750
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK SMT D-PAK/TO-252 TIN
|
0.900" (22.86mm) | SMD Pad | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
4,764
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK SMT D-PAK/TO-252 TIN
|
0.900" (22.86mm) | SMD Pad | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | ||
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Advanced Thermal Solutions Inc. |
938
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-252 D-PAK COPPER
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0.842" (21.40mm) | - | - | 21.00°C/W @ 200 LFM | 28.00°C/W | |||
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CUI Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, STAMPING, TO-252, 8 X
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0.900" (22.86mm) | - | 2.1W @ 75°C | 10.05°C/W @ 200 LFM | 35.71°C/W | ||
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Comair Rotron |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 22.9X8X10.2MM
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0.900" (22.86mm) | SMD Pad | 2.5W @ 35°C | 17.50°C/W @ 300 LFM | - |
