- Length：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 13
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
12,250
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK D2PAK .4" HIGH SMD
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- | Top Mount | 0.500" (12.70mm) | 1.030" (26.16mm) | SMD Pad | TO-263 (D2Pak) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
12,300
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK D2PAK .4" HIGH SMD
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- | Top Mount | 0.500" (12.70mm) | 1.030" (26.16mm) | SMD Pad | TO-263 (D2Pak) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | ||
|
|
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Aavid, Thermal Division of Boyd Corporation |
12,300
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
|
- | Top Mount | 0.500" (12.70mm) | 1.030" (26.16mm) | SMD Pad | TO-263 (D2Pak) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
16,283
|
3 dias |
-
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MOQ: 1 MPQ: 1
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TOP MOUNT HEATSINK .4" D2PAK
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- | Top Mount | 0.500" (12.70mm) | 1.030" (26.16mm) | SMD Pad | TO-263 (D2Pak) | 1.3W @ 30°C | 8.00°C/W @ 300 LFM | 18.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
9,699
|
3 dias |
-
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MOQ: 1 MPQ: 1
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TOP MOUNT HEATSINK .4" D-PAK
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- | Top Mount | 0.315" (8.00mm) | 0.900" (22.86mm) | SMD Pad | TO-252 (DPAK) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
4,750
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK SMT D-PAK/TO-252 TIN
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- | Top Mount | 0.315" (8.00mm) | 0.900" (22.86mm) | SMD Pad | TO-252 (DPAK) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
4,764
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK SMT D-PAK/TO-252 TIN
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- | Top Mount | 0.315" (8.00mm) | 0.900" (22.86mm) | SMD Pad | TO-252 (DPAK) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | ||
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Advanced Thermal Solutions Inc. |
1,458
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TRIPLE TO-126 COPPER
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- | Board Level, Vertical | 1.759" (44.68mm) | 1.750" (44.45mm) | Clip and Board Mounts | TO-126 | - | 6.50°C/W @ 200 LFM | 15.00°C/W | |||
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Advanced Thermal Solutions Inc. |
938
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-252 D-PAK COPPER
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- | Top Mount | 0.315" (8.00mm) | 0.842" (21.40mm) | - | TO-252 (DPAK) | - | 21.00°C/W @ 200 LFM | 28.00°C/W | |||
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CUI Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, STAMPING, TO-252, 8 X
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- | Top Mount | 0.315" (8.00mm) | 0.900" (22.86mm) | - | TO-252 (DPAK) | 2.1W @ 75°C | 10.05°C/W @ 200 LFM | 35.71°C/W | ||
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Wakefield-Vette |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM BLACK SMD
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218 | Top Mount | 0.320" (8.13mm) | 0.900" (22.86mm) | SMD Pad | SMD | 2.0W @ 62°C | 21.00°C/W @ 200 LFM | 31.00°C/W | ||
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Wakefield-Vette |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM NATURAL SMD
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218 | Top Mount | 0.500" (12.70mm) | 1.030" (26.16mm) | SMD Pad | SMD | 2.3W @ 40°C | 5.00°C/W @ 600 LFM | 31.00°C/W | ||
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Comair Rotron |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 22.9X8X10.2MM
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- | Top Mount | 0.315" (8.00mm) | 0.900" (22.86mm) | SMD Pad | TO-252 (DPAK) | 2.5W @ 35°C | 17.50°C/W @ 300 LFM | - |
