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- Material:
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- Package Cooled:
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- Condiciones seleccionadas:
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Material Finish | ||
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Material Finish | ||
Aavid, Thermal Division of Boyd Corporation |
117
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3 dias |
-
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MOQ: 1 MPQ: 1
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COPPER HEATSINK 57.9X59X11MM
|
- | Top Mount | Copper | 2.323" (59.00mm) | 2.280" (57.91mm) | Push Pin | BGA | 0.433" (11.00mm) | 1.90°C/W @ 200 LFM | AavSHIELD 3C | ||||
CTS Thermal Management Products |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
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HEATSINK BOARD MNT BLACK TO-3
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UP10 | Board Level | Aluminum | 3.380" (85.85mm) | 1.400" (35.56mm) | Bolt On | TO-3 (Dual) | 0.440" (11.18mm) | - | Black Anodized |