Descubre los productos 3
La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Type Length Width Attachment Method Package Cooled Height Off Base (Height of Fin) Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural
7022B-MTG
Aavid, Thermal Division of Boyd Corporation
2,934
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 TAB FOLD 55.12MM
Board Level, Vertical 1.968" (49.99mm) 1.986" (50.44mm) Bolt On and PC Pin TO-220 0.375" (9.52mm) 1.75°C/W @ 800 LFM 6.50°C/W
506007B00000G
Aavid, Thermal Division of Boyd Corporation
283
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-3 LOW PROFILE .375"
Board Level 2.000" (50.80mm) 1.750" (44.45mm) Bolt On TO-3 0.375" (9.52mm) 3.00°C/W @ 400 LFM 7.00°C/W
822812B00000
Comair Rotron
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK STAMP 17.8X44.5X12.7MM
Board Level 0.700" (17.78mm) 1.750" (44.45mm) Bolt On TO-220 0.500" (12.70mm) 4.00°C/W @ 300 LFM -