- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
283
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-3 LOW PROFILE .375"
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2.000" (50.80mm) | TO-3 | 0.375" (9.52mm) | 3.00°C/W @ 400 LFM | 7.00°C/W | ||
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Comair Rotron |
Consulta
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-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 17.8X44.5X12.7MM
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0.700" (17.78mm) | TO-220 | 0.500" (12.70mm) | 4.00°C/W @ 300 LFM | - |
