- Type：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
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CUI Inc. |
Consulta
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 4.4W ALUMINUM
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Board Level | 0.700" (17.78mm) | 0.779" (19.80mm) | Bolt On | 0.850" (21.60mm) | 6.86°C/W @ 200 LFM | ||
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CUI Inc. |
Consulta
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 4.4W ALUMINUM
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Top Mount | 0.375" (9.53mm) | 0.985" (25.00mm) | Clip and Board Mounts | 0.961" (24.40mm) | 4.51°C/W @ 200 LFM |
