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- Length：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 17
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
18,195
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 2.5W LOW PROFILE
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- | Board Level | Aluminum | Square, Fins | 0.750" (19.05mm) | Bolt On | TO-220 | 0.380" (9.65mm) | 2.5W @ 60°C | 10.00°C/W @ 200 LFM | 24.00°C/W | Black Anodized | ||
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ASSMANN WSW Components |
6,080
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 19.05x9.52MM
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- | Board Level | Aluminum | Square, Fins | 0.750" (19.05mm) | Bolt On | TO-220 | 0.375" (9.52mm) | - | - | 24.00°C/W | Black Anodized | ||
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Wakefield-Vette |
6,905
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 LOW HEIGHT BLK
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273 | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | Bolt On | TO-220, TO-218 | 0.375" (9.52mm) | 2.0W @ 49°C | 7.20°C/W @ 400 LFM | 24.50°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
15,536
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3 dias |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEATSINK .375"TO-220
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- | Board Level, Vertical | Copper | Rectangular, Fins | 0.750" (19.05mm) | Bolt On and PC Pin | TO-220 | 0.375" (9.52mm) | 1.5W @ 50°C | 10.00°C/W @ 200 LFM | 25.80°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
2,586
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK 1.75" HIGH RISE TO-220
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.750" (44.45mm) | Clip and Board Mounts | TO-220 | 1.750" (44.45mm) | 4.0W @ 30°C | 2.00°C/W @ 400 LFM | 6.30°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
2,568
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 LOW PROFILE
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- | Board Level | Aluminum | Square, Fins | 0.750" (19.05mm) | Bolt On | TO-220 | 0.375" (9.52mm) | - | 10.00°C/W @ 200 LFM | 24.00°C/W | Black Anodized | |||
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t-Global Technology |
160
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3 dias |
-
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MOQ: 1 MPQ: 1
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PH3 76.2X19.1X0.21MM
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PH3 | Heat Spreader | Copper | Rectangular | 3.000" (76.20mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | - | - | Polyester | ||
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t-Global Technology |
49
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3 dias |
-
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MOQ: 1 MPQ: 1
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PH3N NANO 76.2X19.1X0.062MM
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PH3n | Heat Spreader | Copper | Rectangular | 3.000" (76.20mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.002" (0.06mm) | - | - | - | Polyester | ||
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t-Global Technology |
11
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3 dias |
-
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MOQ: 1 MPQ: 1
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PH3N NANO 76.2X19.1X0.07MM
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PH3n | Heat Spreader | Copper | Rectangular | 3.000" (76.20mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.003" (0.07mm) | - | - | - | Polyester | ||
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Advanced Thermal Solutions Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 HOR MNT LOW PRO
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- | Board Level | Aluminum | Square, Fins | 0.750" (19.05mm) | Bolt On | TO-220 | 0.375" (9.52mm) | - | 10.00°C/W @ 200 LFM | 24.00°C/W | Black Anodized | |||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | Bolt On | TO-202 | 0.375" (9.52mm) | 1.5W @ 40°C | 10.00°C/W @ 200 LFM | 21.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | Aluminum | Rectangular | 1.000" (25.40mm) | Clip | TO-220 | 0.350" (8.89mm) | 1.0W @ 30°C | 16.00°C/W @ 200 LFM | 26.00°C/W | Black Anodized | ||
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Seeed Technology Co., Ltd |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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ULTRATHIN HEAT SINK FOR CUBIEBOA
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- | Top Mount | - | Square, Fins | 0.750" (19.05mm) | Adhesive | - | 0.205" (5.21mm) | - | - | - | - | |||
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CTS Thermal Management Products |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK VERT .187"H BLK TO-220
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7 | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | Bolt On and PC Pin | TO-220 | 0.187" (4.75mm) | 1.5W @ 50°C | - | 33.90°C/W | Black Anodized | ||
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CTS Thermal Management Products |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK VERT .375"H BLK TO-220
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7 | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | Bolt On | TO-220 | 0.375" (9.52mm) | 2.0W @ 50°C | - | 27.00°C/W | Black Anodized | ||
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CTS Thermal Management Products |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK HORZ .375"H BLK TO-220
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- | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | Bolt On | TO-126, TO-127, TO-220 | 0.375" (9.52mm) | - | - | 27.30°C/W | Black Anodized | ||
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Comair Rotron |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 9.5X19X19MM
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- | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | Bolt On | TO-220 | 0.375" (9.52mm) | 1.0W @ 30°C | 6.00°C/W @ 500 LFM | - | Black Anodized |
