- Material:
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- Attachment Method:
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- Height Off Base (Height of Fin):
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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- Condiciones seleccionadas:
Descubre los productos 8
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
ASSMANN WSW Components |
6,080
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 19.05x9.52MM
|
- | Board Level | Aluminum | Square, Fins | 0.750" (19.05mm) | Bolt On | TO-220 | 0.375" (9.52mm) | - | 24.00°C/W | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
2,568
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 LOW PROFILE
|
- | Board Level | Aluminum | Square, Fins | 0.750" (19.05mm) | Bolt On | TO-220 | 0.375" (9.52mm) | 10.00°C/W @ 200 LFM | 24.00°C/W | Black Anodized | ||||
t-Global Technology |
160
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
PH3 76.2X19.1X0.21MM
|
PH3 | Heat Spreader | Copper | Rectangular | 3.000" (76.20mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | - | Polyester | ||||
t-Global Technology |
49
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 76.2X19.1X0.062MM
|
PH3n | Heat Spreader | Copper | Rectangular | 3.000" (76.20mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.002" (0.06mm) | - | - | Polyester | ||||
t-Global Technology |
11
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 76.2X19.1X0.07MM
|
PH3n | Heat Spreader | Copper | Rectangular | 3.000" (76.20mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.003" (0.07mm) | - | - | Polyester | ||||
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 HOR MNT LOW PRO
|
- | Board Level | Aluminum | Square, Fins | 0.750" (19.05mm) | Bolt On | TO-220 | 0.375" (9.52mm) | 10.00°C/W @ 200 LFM | 24.00°C/W | Black Anodized | ||||
Seeed Technology Co., Ltd |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
ULTRATHIN HEAT SINK FOR CUBIEBOA
|
- | Top Mount | - | Square, Fins | 0.750" (19.05mm) | Adhesive | - | 0.205" (5.21mm) | - | - | - | ||||
CTS Thermal Management Products |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK HORZ .375"H BLK TO-220
|
- | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | Bolt On | TO-126, TO-127, TO-220 | 0.375" (9.52mm) | - | 27.30°C/W | Black Anodized |