- Material:
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- Attachment Method:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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- Condiciones seleccionadas:
Descubre los productos 6
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Material | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Material | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
Aavid, Thermal Division of Boyd Corporation |
3,006
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK W/TAB BLACK
|
Board Level, Vertical | Aluminum | 1.220" (30.99mm) | 1.000" (25.40mm) | Clip and PC Pin | 0.500" (12.70mm) | 2.0W @ 30°C | 4.00°C/W @ 300 LFM | 11.50°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | Aluminum | 0.620" (15.75mm) | 0.915" (23.24mm) | Clip | 0.380" (9.65mm) | 1.5W @ 40°C | 6.00°C/W @ 600 LFM | 16.00°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | Aluminum | 0.620" (15.75mm) | 0.845" (21.46mm) | Clip | 0.380" (9.65mm) | 2.0W @ 50°C | 6.00°C/W @ 400 LFM | 20.60°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | Aluminum | 1.220" (30.99mm) | 1.000" (25.40mm) | Clip | 0.500" (12.70mm) | 3.0W @ 40°C | 4.00°C/W @ 300 LFM | 11.50°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Copper | 0.795" (20.19mm) | 0.915" (23.24mm) | Clip and PC Pin | 0.380" (9.65mm) | 1.0W @ 30°C | 6.00°C/W @ 600 LFM | 16.00°C/W | Tin | ||||
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 CLIP-ON W/TABS
|
Board Level, Vertical | Aluminum | 1.220" (30.99mm) | 1.000" (25.40mm) | Clip and Board Locks | 0.500" (12.70mm) | 2.0W @ 30°C | 5.00°C/W @ 200 LFM | 11.50°C/W | Black Anodized |