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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 5
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Advanced Thermal Solutions Inc. |
Consulta
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 BLACK
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Board Level | Rectangular, Angled Fins | 0.748" (19.00mm) | 0.787" (20.00mm) | Bolt On | TO-220 | 0.433" (11.00mm) | - | 30.00°C/W | |||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Top Mount | Rectangular, Fins | 0.602" (15.29mm) | - | Press Fit | TO-92 | 1.220" (31.00mm) | 0.5W @ 20°C | 40.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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-
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MOQ: 1 MPQ: 1
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HEATSINK 20-DIP BLK ANODIZED
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Top Mount | Rectangular, Fins | 1.055" (26.80mm) | 0.700" (17.78mm) | Press Fit, Slide On | 20-DIP | 0.556" (14.12mm) | 2.0W @ 60°C | 39.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK 18-DIP BLK ANODIZED
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Top Mount | Rectangular, Fins | 1.125" (28.58mm) | 0.700" (17.78mm) | Press Fit, Slide On | 18-DIP | 0.556" (14.12mm) | 2.0W @ 60°C | 39.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Square | 0.790" (20.07mm) | 0.790" (20.07mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.155" (3.94mm) | 1.0W @ 40°C | - |
