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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 1,708
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Advanced Thermal Solutions Inc. |
2,488
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK FOR TI MOD #TPA3130D
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- | - | - | - | - | - | - | - | - | - | - | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
1,806
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK PIN-FIN W/TAPE
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- | - | - | - | - | - | - | - | - | - | - | - | - | ||
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Wakefield-Vette |
621
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATPIPE SINTERED 6X0.3X100MM
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- | Heat Pipe | Copper | Round | 3.937" (100.00mm) | - | 0.236" (6.00mm) OD | - | - | - | - | - | - | ||
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Wakefield-Vette |
113
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR PWR MOD/IGBT/RELAY
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510 | Top Mount | Aluminum | Rectangular, Fins | 6.000" (152.40mm) | 7.380" (187.45mm) | - | Adhesive | Power Modules | 3.106" (78.89mm) | - | - | 0.38°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
40
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3 dias |
-
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MOQ: 1 MPQ: 1
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74765 EXTRUSION 1.025X4.235"X5
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- | Top Mount | Aluminum | Rectangular, Fins | 60.000" (1524.00mm) | 4.235" (107.57mm) | - | Adhesive | - | 1.025" (26.03mm) | - | 0.50°C/W @ 500 LFM | - | ||
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Wakefield-Vette |
39
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR PWR MOD/IGBT/RELAY
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510 | Top Mount | Aluminum | Rectangular, Fins | 14.000" (355.60mm) | 7.380" (187.45mm) | - | Adhesive | Power Modules | 3.136" (79.65mm) | - | - | 0.21°C/W | ||
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Wakefield-Vette |
30
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FOR PWR MOD/IGBT/RELAY
|
510 | Top Mount | Aluminum | Rectangular, Fins | 14.000" (355.60mm) | 7.380" (187.45mm) | - | Adhesive | Power Modules | 3.106" (78.89mm) | - | - | 0.21°C/W | ||
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t-Global Technology |
5,067
|
3 dias |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC BOARD 10X10X2MM
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XL-25 | Heat Spreader | Ceramic | Square | 0.393" (10.00mm) | 0.393" (10.00mm) | - | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.079" (2.00mm) | - | - | - | ||
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t-Global Technology |
2,715
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3 dias |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC 10X10MM W/LI98C ADH
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XL-25 | Heat Spreader | Ceramic | Square | 0.393" (10.00mm) | 0.393" (10.00mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.089" (2.25mm) | - | - | - | ||
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t-Global Technology |
5,198
|
3 dias |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC BOARD 20X20X2MM
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XL-25 | Heat Spreader | Ceramic | Square | 0.787" (20.00mm) | 0.787" (20.00mm) | - | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.079" (2.00mm) | - | - | - | ||
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t-Global Technology |
4,024
|
3 dias |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC 20X20MM W/LI98C ADH
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XL-25 | Heat Spreader | Ceramic | Square | 0.787" (20.00mm) | 0.787" (20.00mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.089" (2.25mm) | - | - | - | ||
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t-Global Technology |
4,065
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CER 12X12X10MM W/TAPE
|
- | Heat Spreader | Ceramic | Square, Fins | 0.472" (12.00mm) | 0.472" (12.00mm) | - | Thermal Tape, Adhesive (Included) | - | 0.394" (10.00mm) | - | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
6,635
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 STAGGEREDFIN TIN
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- | - | - | - | - | - | - | - | - | - | - | - | - | ||
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t-Global Technology |
1,483
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CER 20X20X6MM W/TAPE
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- | Heat Spreader | Ceramic | Square, Fins | 0.787" (20.00mm) | 0.787" (20.00mm) | - | Thermal Tape, Adhesive (Included) | - | 0.236" (6.00mm) | - | - | - | ||
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Wakefield-Vette |
2,089
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 W/PINS BLK 1.5"
|
- | - | - | - | - | - | - | - | - | - | - | - | - | ||
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Wakefield-Vette |
1,943
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 W/PINS
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667 | - | - | - | - | - | - | - | - | - | - | - | - | ||
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Wakefield-Vette |
4,209
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK 100PQFP COMPOSITE
|
Deltem | Top Mount | Composite | Square, Pin Fins | 0.650" (16.51mm) | 0.650" (16.51mm) | - | Thermal Tape, Adhesive (Not Included) | BGA | 0.400" (10.16mm) | 2.0W @ 40°C | 25.00°C/W @ 350 LFM | - | ||
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t-Global Technology |
367
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CER 30.5X30.5X6MM W/TAP
|
- | Heat Spreader | Ceramic | Square, Fins | 1.201" (30.50mm) | 1.201" (30.50mm) | - | Thermal Tape, Adhesive (Included) | - | 0.236" (6.00mm) | - | - | - | ||
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Wakefield-Vette |
900
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 128PQFP COMPOSITE
|
Deltem | Top Mount | Composite | Square, Pin Fins | 0.850" (21.59mm) | 0.850" (21.59mm) | - | Thermal Tape, Adhesive (Not Included) | BGA | 0.400" (10.16mm) | 2.5W @ 90°C | 20.00°C/W @ 100 LFM | - | ||
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Advanced Thermal Solutions Inc. |
664
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
FLAT HEATPIPE 70W 3X8X100MM
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- | Heat Pipe | Copper | Flat | 3.937" (100.00mm) | 0.315" (8.00mm) | - | - | - | 0.118" (3.00mm) | - | - | - |
