- Series：
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- Material：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 11
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Wakefield-Vette |
4,209
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 100PQFP COMPOSITE
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Deltem | Top Mount | Composite | Square, Pin Fins | 0.650" (16.51mm) | 0.650" (16.51mm) | Thermal Tape, Adhesive (Not Included) | BGA | 2.0W @ 40°C | 25.00°C/W @ 350 LFM | - | ||
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Wakefield-Vette |
900
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 128PQFP COMPOSITE
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Deltem | Top Mount | Composite | Square, Pin Fins | 0.850" (21.59mm) | 0.850" (21.59mm) | Thermal Tape, Adhesive (Not Included) | BGA | 2.5W @ 90°C | 20.00°C/W @ 100 LFM | - | ||
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|
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Apex Microtechnology |
12
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR DK AND HQ PACKAGES
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Apex Precision Power | Board Level | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 0.400" (10.16mm) | Bolt On | - | - | - | 16.00°C/W | ||
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Wakefield-Vette |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 100PQFP COMPOSITE
|
Deltem | Top Mount | Composite | Square, Pin Fins | 0.650" (16.51mm) | 0.650" (16.51mm) | Thermal Tape, Adhesive (Included) | BGA | 2.0W @ 40°C | 25.00°C/W @ 350 LFM | - | ||
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|
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Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 100PQFP COMPOSITE
|
Deltem | Top Mount | Composite | Square, Pin Fins | 0.650" (16.51mm) | 0.650" (16.51mm) | Thermal Tape, Adhesive (Included) | BGA | 2.0W @ 40°C | 25.00°C/W @ 350 LFM | - | ||
|
|
|
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 100PQFP COMPOSITE
|
Deltem | Top Mount | Composite | Square, Pin Fins | 0.650" (16.51mm) | 0.650" (16.51mm) | Thermal Tape, Adhesive (Included) | BGA | 2.0W @ 40°C | 25.00°C/W @ 350 LFM | - | ||
|
|
|
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 100PQFP COMPOSITE
|
Deltem | Top Mount | Composite | Square, Pin Fins | 0.650" (16.51mm) | 0.650" (16.51mm) | Thermal Tape, Adhesive (Included) | BGA | 2.0W @ 40°C | 25.00°C/W @ 350 LFM | - | ||
|
|
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Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 128PQFP COMPOSITE
|
Deltem | Top Mount | Composite | Square, Pin Fins | 0.850" (21.59mm) | 0.850" (21.59mm) | Thermal Tape, Adhesive (Included) | BGA | 2.5W @ 90°C | 20.00°C/W @ 100 LFM | - | ||
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|
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Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 128PQFP COMPOSITE
|
Deltem | Top Mount | Composite | Square, Pin Fins | 0.850" (21.59mm) | 0.850" (21.59mm) | Thermal Tape, Adhesive (Included) | BGA | 2.5W @ 90°C | 20.00°C/W @ 100 LFM | - | ||
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|
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Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 128PQFP COMPOSITE
|
Deltem | Top Mount | Composite | Square, Pin Fins | 0.850" (21.59mm) | 0.850" (21.59mm) | Thermal Tape, Adhesive (Included) | BGA | 2.5W @ 90°C | 20.00°C/W @ 100 LFM | - | ||
|
|
|
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 128PQFP COMPOSITE
|
Deltem | Top Mount | Composite | Square, Pin Fins | 0.850" (21.59mm) | 0.850" (21.59mm) | Thermal Tape, Adhesive (Included) | BGA | 2.5W @ 90°C | 20.00°C/W @ 100 LFM | - |
