- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Advanced Thermal Solutions Inc. |
37
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK AL6063 254X101X14MM
|
Rectangular, Fins | 10.000" (254.00mm) | Adhesive | - | 0.551" (14.00mm) | 1.80°C/W @ 200 LFM | 14.70°C/W | Degreased | |||
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Wakefield-Vette |
69
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK EXTRUSION 15.25"
|
Rectangular, Fins | 15.250" (387.35mm) | - | Power Modules | 1.880" (47.75mm) | - | - | - | ||
|
|
Advanced Thermal Solutions Inc. |
31
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 94MM X 101MM X 27MM
|
Rectangular, Angled Fins | 3.700" (94.00mm) | Push Pin | LGA | 1.063" (27.00mm) | 1.00°C/W @ 200 LFM | - | Black Anodized |
