- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
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- Condiciones seleccionadas:
Descubre los productos 6
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Length | Width | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Length | Width | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | 1.550" (39.37mm) | 1.040" (26.42mm) | 1.250" (31.75mm) | 7.0W @ 50°C | 4.00°C/W @ 200 LFM | 8.00°C/W | ||||
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | 1.550" (39.37mm) | 1.040" (26.42mm) | 0.500" (12.70mm) | 2.0W @ 30°C | 7.00°C/W @ 200 LFM | 10.70°C/W | ||||
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | 1.550" (39.37mm) | 1.040" (26.42mm) | 0.750" (19.05mm) | 6.0W @ 60°C | 2.00°C/W @ 800 LFM | 9.60°C/W | ||||
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | 1.550" (39.37mm) | 1.040" (26.42mm) | 1.000" (25.40mm) | 4.0W @ 40°C | 4.00°C/W @ 300 LFM | 8.00°C/W | ||||
CTS Thermal Management Products |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK PWR .50"H BLACK TO-3
|
- | 1.321" (33.56mm) | 1.120" (28.45mm) | 0.500" (12.70mm) | - | - | 17.10°C/W | ||||
CTS Thermal Management Products |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK
|
7 | 1.550" (39.37mm) | 1.040" (26.42mm) | 0.750" (19.05mm) | 6.0W @ 60°C | - | 12.00°C/W |