- Material:
-
- Attachment Method:
-
- Package Cooled:
-
- Height Off Base (Height of Fin):
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
- Material Finish:
-
- Condiciones seleccionadas:
Descubre los productos 15
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
Ohmite |
26,220
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AND CLIP FOR TO-247
|
W | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.921" (23.40mm) | Clip and PC Pin | TO-247 | 0.630" (16.00mm) | 1.0W @ 20°C | 8.00°C/W @ 500 LFM | 9.00°C/W | Degreased | ||||
Ohmite |
8,370
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AND CLIP FOR TO-247 BLK
|
W | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.921" (23.40mm) | Clip and PC Pin | TO-247 | 0.630" (16.00mm) | 1.0W @ 20°C | 8.00°C/W @ 500 LFM | 7.00°C/W | Black Anodized | ||||
Ohmite |
820
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK W/CLIP FOR TO-264
|
W | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.921" (23.40mm) | Clip and PC Pin | TO-264 | 0.630" (16.00mm) | 1.0W @ 20°C | 8.00°C/W @ 500 LFM | 11.00°C/W | Black Anodized | ||||
Wakefield-Vette |
993
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
ANCHOR HEATSINK 32X32X12MM
|
Wave 3x | Board Level | Aluminum Alloy | Square, Angled Fins | 1.260" (32.00mm) | Clip | BGA | 0.472" (12.00mm) | - | 4.64°C/W @ 200 LFM | - | Black Anodized | ||||
t-Global Technology |
264
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CER 32X32X6MM W/TAPE
|
- | Heat Spreader | Ceramic | Square, Fins | 1.260" (32.00mm) | Thermal Tape, Adhesive (Included) | - | 0.236" (6.00mm) | - | - | - | - | ||||
Ohmite |
806
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK W/CLIP FOR TO-264
|
W | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.921" (23.40mm) | Clip and PC Pin | TO-264 | 0.630" (16.00mm) | 1.0W @ 20°C | 8.00°C/W @ 500 LFM | 12.00°C/W | Unfinished | ||||
t-Global Technology |
156
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CER 32X32X6MM
|
- | Heat Spreader | Ceramic | Square, Fins | 1.260" (32.00mm) | - | - | 0.236" (6.00mm) | - | - | - | - | ||||
Advanced Thermal Solutions Inc. |
98
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
SUPERGRIP HEATSINK 32X32X7.5MM
|
superGRIP | Top Mount | Aluminum | Square, Fins | 1.260" (32.00mm) | Clip, Thermal Material | BGA | 0.295" (7.50mm) | - | 11.30°C/W @ 200 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
100
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
SUPERGRIP HEATSINK 32X32X7.5MM
|
maxiFLOW, superGRIP | Top Mount | Aluminum | Square, Angled Fins | 1.260" (32.00mm) | Clip, Thermal Material | BGA | 0.295" (7.50mm) | - | 5.90°C/W @ 200 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
100
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
SUPERGRIP HEATSINK 32X32X12.5MM
|
superGRIP | Top Mount | Aluminum | Square, Fins | 1.260" (32.00mm) | Clip, Thermal Material | BGA | 0.492" (12.50mm) | - | 5.90°C/W @ 200 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
61
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 32MM X 50MM X 12MM
|
maxiGRIP | Top Mount | Aluminum | Rectangular, Angled Fins | 1.969" (50.00mm) | Clip | Flip Chip Processors | 0.472" (12.00mm) | - | 3.80°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
97
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 32MM X 50MM X 12MM
|
maxiGRIP | Top Mount | Aluminum | Rectangular, Angled Fins | 1.969" (50.00mm) | Clip | Flip Chip Processors | 0.472" (12.00mm) | - | 3.20°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
100
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
SUPERGRIP HEATSINK 32X32X12.5MM
|
maxiFLOW, superGRIP | Top Mount | Aluminum | Square, Angled Fins | 1.260" (32.00mm) | Clip, Thermal Material | BGA | 0.492" (12.50mm) | - | 3.50°C/W @ 200 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
99
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
SUPERGRIP HEATSINK 32X32X17.5MM
|
superGRIP | Top Mount | Aluminum | Square, Fins | 1.260" (32.00mm) | Clip, Thermal Material | BGA | 0.689" (17.50mm) | - | 4.10°C/W @ 200 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
100
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
SUPERGRIP HEATSINK 32X32X17.5MM
|
maxiFLOW, superGRIP | Top Mount | Aluminum | Square, Angled Fins | 1.260" (32.00mm) | Clip, Thermal Material | BGA | 0.689" (17.50mm) | - | 2.70°C/W @ 200 LFM | - | Blue Anodized |