- Type：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | |
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Wakefield-Vette |
26
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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HEATSINK FOR PWR MOD/IGBT/RELAY
|
510 | Top Mount | Rectangular, Fins | 12.000" (304.80mm) | 7.380" (187.45mm) | Adhesive | Power Modules | 3.106" (78.89mm) | ||
|
|
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Wakefield-Vette |
21
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR PWR MOD/IGBT/RELAY
|
510 | Top Mount | Rectangular, Fins | 12.000" (304.80mm) | 7.380" (187.45mm) | Adhesive | Power Modules | 3.136" (79.65mm) | ||
|
|
|
Delta Electronics |
28
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ASSY INTEL LGA2011
|
- | Board Level | Square, Fins | 3.602" (91.50mm) | 3.602" (91.50mm) | Bolt On | LGA | 1.004" (25.50mm) |
