Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
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La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
326005B00000G
Aavid, Thermal Division of Boyd Corporation
3,068
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-5 1W H=.375" BLK
0.375" (9.52mm) 1.8W @ 90°C 30.00°C/W @ 200 LFM 57.00°C/W Black Anodized
325705B00000G
Aavid, Thermal Division of Boyd Corporation
421
3 dias
-
MOQ: 1  MPQ: 1
TO-5 PUSH-ON HEATSINK 6.35MM
0.250" (6.35mm) 1.0W @ 60°C 35.00°C/W @ 200 LFM 60.00°C/W Black Anodized
320105B00000G
Aavid, Thermal Division of Boyd Corporation
953
3 dias
-
MOQ: 1  MPQ: 1
TO-5 PUSH-ON HEATSINK 6.35MM
0.250" (6.35mm) 0.6W @ 40°C 35.00°C/W @ 200 LFM 63.00°C/W Black Anodized
325705R00000G
Aavid, Thermal Division of Boyd Corporation
Consulta
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
0.250" (6.35mm) 1.0W @ 60°C 35.00°C/W @ 200 LFM 60.00°C/W Red Anodized
326005R00000G
Aavid, Thermal Division of Boyd Corporation
Consulta
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
0.375" (9.52mm) 1.8W @ 90°C 30.00°C/W @ 200 LFM 57.00°C/W Red Anodized