- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Condiciones seleccionadas:
Descubre los productos 4
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Aavid, Thermal Division of Boyd Corporation |
3,006
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK W/TAB BLACK
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- | Board Level, Vertical | Rectangular, Fins | 1.220" (30.99mm) | 1.000" (25.40mm) | Clip and PC Pin | Multiwatt, SIP | 0.500" (12.70mm) | 2.0W @ 30°C | 4.00°C/W @ 300 LFM | ||
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CTS Thermal Management Products |
113
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU W/ADHESIVE 1.71"SQ
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BDN | Top Mount | Square, Pin Fins | 1.710" (43.43mm) | 1.710" (43.43mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 3.80°C/W @ 400 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | Rectangular, Fins | 1.220" (30.99mm) | 1.000" (25.40mm) | Clip | Multiwatt, SIP | 0.500" (12.70mm) | 3.0W @ 40°C | 4.00°C/W @ 300 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 CLIP-ON W/TABS
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- | Board Level, Vertical | Rectangular, Fins | 1.220" (30.99mm) | 1.000" (25.40mm) | Clip and Board Locks | Multiwatt, SIP | 0.500" (12.70mm) | 2.0W @ 30°C | 5.00°C/W @ 200 LFM |
