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- Length：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 287
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Natural | Material Finish | |
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t-Global Technology |
5,067
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
XL25 CERAMIC BOARD 10X10X2MM
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XL-25 | Ceramic | Square | 0.393" (10.00mm) | 0.393" (10.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.079" (2.00mm) | - | - | ||
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|
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t-Global Technology |
2,715
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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XL25 CERAMIC 10X10MM W/LI98C ADH
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XL-25 | Ceramic | Square | 0.393" (10.00mm) | 0.393" (10.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.089" (2.25mm) | - | - | ||
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|
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t-Global Technology |
5,198
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
XL25 CERAMIC BOARD 20X20X2MM
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XL-25 | Ceramic | Square | 0.787" (20.00mm) | 0.787" (20.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.079" (2.00mm) | - | - | ||
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|
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t-Global Technology |
4,024
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
XL25 CERAMIC 20X20MM W/LI98C ADH
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XL-25 | Ceramic | Square | 0.787" (20.00mm) | 0.787" (20.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.089" (2.25mm) | - | - | ||
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|
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t-Global Technology |
4,065
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CER 12X12X10MM W/TAPE
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- | Ceramic | Square, Fins | 0.472" (12.00mm) | 0.472" (12.00mm) | Thermal Tape, Adhesive (Included) | - | 0.394" (10.00mm) | - | - | ||
|
|
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t-Global Technology |
1,483
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CER 20X20X6MM W/TAPE
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- | Ceramic | Square, Fins | 0.787" (20.00mm) | 0.787" (20.00mm) | Thermal Tape, Adhesive (Included) | - | 0.236" (6.00mm) | - | - | ||
|
|
|
t-Global Technology |
367
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CER 30.5X30.5X6MM W/TAP
|
- | Ceramic | Square, Fins | 1.201" (30.50mm) | 1.201" (30.50mm) | Thermal Tape, Adhesive (Included) | - | 0.236" (6.00mm) | - | - | ||
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|
|
t-Global Technology |
166
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
PH3 101.6X38.1X0.21MM
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PH3 | Copper | Rectangular | 4.000" (101.60mm) | 1.500" (38.10mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | Polyester | ||
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t-Global Technology |
1,228
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
XL25 CERAMIC 30X30MM W/LI98C ADH
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XL-25 | Ceramic | Square | 1.181" (30.00mm) | 1.181" (30.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.085" (2.15mm) | - | - | ||
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|
|
t-Global Technology |
4,410
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
XL25 CERAMIC BOARD 40X40X3MM
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XL-25 | Ceramic | Square | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.118" (3.00mm) | - | - | ||
|
|
|
t-Global Technology |
1,145
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CER 12X12X10MM
|
- | Ceramic | Square, Fins | 0.472" (12.00mm) | 0.472" (12.00mm) | - | - | 0.394" (10.00mm) | - | - | ||
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|
|
American Technical Ceramics |
2,000
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Beryllium Oxide Ceramic | Rectangular | 0.060" (1.52mm) | 0.030" (0.76mm) | SMD Pad | - | 0.025" (0.64mm) | 13.00°C/W | - | ||
|
|
|
American Technical Ceramics |
2,800
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Beryllium Oxide Ceramic | Rectangular | 0.060" (1.52mm) | 0.030" (0.76mm) | SMD Pad | - | 0.025" (0.64mm) | 13.00°C/W | - | ||
|
|
|
American Technical Ceramics |
2,800
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Beryllium Oxide Ceramic | Rectangular | 0.060" (1.52mm) | 0.030" (0.76mm) | SMD Pad | - | 0.025" (0.64mm) | 13.00°C/W | - | ||
|
|
|
American Technical Ceramics |
7,000
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Beryllium Oxide Ceramic | Rectangular | 0.080" (2.03mm) | 0.050" (1.27mm) | SMD Pad | - | 0.040" (1.02mm) | 7.00°C/W | - | ||
|
|
|
American Technical Ceramics |
7,836
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Beryllium Oxide Ceramic | Rectangular | 0.080" (2.03mm) | 0.050" (1.27mm) | SMD Pad | - | 0.040" (1.02mm) | 7.00°C/W | - | ||
|
|
|
American Technical Ceramics |
7,836
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Beryllium Oxide Ceramic | Rectangular | 0.080" (2.03mm) | 0.050" (1.27mm) | SMD Pad | - | 0.040" (1.02mm) | 7.00°C/W | - | ||
|
|
|
American Technical Ceramics |
500
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Aluminum Nitride Ceramic | Rectangular | 0.110" (2.79mm) | 0.110" (2.79mm) | SMD Pad | - | 0.040" (1.02mm) | 7.00°C/W | - | ||
|
|
|
American Technical Ceramics |
936
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Aluminum Nitride Ceramic | Rectangular | 0.110" (2.79mm) | 0.110" (2.79mm) | SMD Pad | - | 0.040" (1.02mm) | 7.00°C/W | - | ||
|
|
|
American Technical Ceramics |
936
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Aluminum Nitride Ceramic | Rectangular | 0.110" (2.79mm) | 0.110" (2.79mm) | SMD Pad | - | 0.040" (1.02mm) | 7.00°C/W | - |
