Fabricante:
Attachment Method:
Package Cooled:
Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Material Finish:
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La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Type Shape Length Width Diameter Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Material Finish
321527B00000G
Aavid, Thermal Division of Boyd Corporation
488
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-5 2W BLK
Top Mount Cylindrical - - 0.750" (19.05mm) OD Threaded Coupling TO-5, TO-39 0.290" (7.37mm) 0.5W @ 20°C 20.00°C/W @ 300 LFM Black Anodized
V6534E1-T
ASSMANN WSW Components
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK ALUM ANOD
Board Level, Vertical Rectangular, Fins 0.393" (10.00mm) 0.984" (25.00mm) - PC Pin TO-220 0.894" (22.71mm) - - Tin
V6534B-T
ASSMANN WSW Components
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK ALUM ANOD
Board Level, Vertical Rectangular, Fins 0.393" (10.00mm) 0.984" (25.00mm) - PC Pin TO-220 0.894" (22.71mm) - - Black Anodized