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- Shape:
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- Width:
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- Attachment Method:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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- Condiciones seleccionadas:
Descubre los productos 75
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
Advanced Thermal Solutions Inc. |
4,769
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 19MM X 19MM X 9MM
|
maxiFLOW | Top Mount | Square, Angled Fins | 0.748" (19.00mm) | Thermal Tape, Adhesive (Included) | ASIC | 0.354" (9.00mm) | - | 5.30°C/W @ 200 LFM | - | Black Anodized | ||||
CTS Thermal Management Products |
1,686
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Top Mount | Square, Fins | 0.748" (19.00mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | 7.10°C/W @ 200 LFM | - | Black Anodized | ||||
CTS Thermal Management Products |
4,900
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Square, Fins | 0.748" (19.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | - | 4.00°C/W @ 200 LFM | - | Black Anodized | ||||
CTS Thermal Management Products |
3,861
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Square, Fins | 0.748" (19.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | 7.10°C/W @ 200 LFM | - | Black Anodized | ||||
CTS Thermal Management Products |
1,900
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Square, Fins | 0.748" (19.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | - | 5.30°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
1,092
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 19MM X 19MM X 9.5MM
|
maxiGRIP, maxiFLOW | Top Mount | Square, Angled Fins | 0.748" (19.00mm) | Clip, Thermal Material | BGA | 0.374" (9.50mm) | - | 16.70°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
2,885
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 CLIP-ON
|
- | Board Level | Rectangular, Fins | 0.504" (12.80mm) | Clip | TO-220 | 0.504" (12.80mm) | - | 4.40°C/W @ 200 LFM | 27.30°C/W | Black Anodized | ||||
ASSMANN WSW Components |
9,919
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 19X12.80MM
|
- | Board Level | Rectangular, Fins | 0.504" (12.80mm) | Press Fit | TO-220 | 0.500" (12.70mm) | 3.0W @ 60°C | 14.00°C/W @ 200 LFM | - | Black Anodized | ||||
ASSMANN WSW Components |
1,169
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Top Mount | Rectangular, Fins | 0.250" (6.35mm) | Press Fit | 14-DIP and 16-DIP | 0.189" (4.80mm) | - | - | 46.00°C/W | Black Anodized | ||||
Wakefield-Vette |
385
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 19X19X12MM PIN
|
901 | Top Mount | Square, Pin Fins | 0.748" (19.00mm) | Clip | BGA | 0.457" (11.60mm) | - | 6.60°C/W @ 200 LFM | 12.70°C/W | Black Anodized | ||||
Wakefield-Vette |
402
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 19X19X23MM PIN
|
901 | Top Mount | Square, Pin Fins | 0.748" (19.00mm) | Clip | BGA | 0.892" (22.65mm) | - | 5.40°C/W @ 200 LFM | 10.60°C/W | Black Anodized | ||||
CTS Thermal Management Products |
371
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Top Mount | Square, Fins | 0.748" (19.00mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | - | 5.30°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
363
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 19MM X 19MM X 9.5MM
|
- | Top Mount | Square, Fins | 0.748" (19.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | - | 24.00°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
595
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 19MM X 19MM X 14.5MM
|
- | Top Mount | Square, Fins | 0.748" (19.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.571" (14.50mm) | 0.3W @ 20°C | 12.00°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
115
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 19MM X 19MM X 12.5MM
|
maxiFLOW | Top Mount | Square, Angled Fins | 0.748" (19.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.492" (12.50mm) | - | 10.20°C/W @ 200 LFM | - | Blue Anodized | ||||
ASSMANN WSW Components |
5,025
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 19X12.8MM
|
- | Board Level, Vertical | Rectangular, Fins | 0.504" (12.80mm) | Press Fit and PC Pin | TO-220 | 0.500" (12.70mm) | - | - | 21.00°C/W | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
1,230
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 CLIP-ON BLACK
|
- | Board Level | Rectangular | 0.504" (12.80mm) | Clip | TO-220 | 0.500" (12.70mm) | - | 10.20°C/W @ 200 LFM | 27.30°C/W | Black Anodized | ||||
ASSMANN WSW Components |
3,369
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 19X12.8MM
|
- | Board Level, Vertical | Rectangular, Fins | 0.504" (12.80mm) | Press Fit and PC Pin | TO-220 | 0.500" (12.70mm) | 2.0W @ 40°C | 8.00°C/W @ 500 LFM | - | Black Anodized | ||||
ASSMANN WSW Components |
1,201
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK ANOD ALUM TO-220
|
- | Board Level | Rectangular, Fins | 0.504" (12.80mm) | PC Pin | TO-220 | 0.500" (12.70mm) | 3.0W @ 60°C | 6.00°C/W @ 600 LFM | 21.00°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
10,548
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO220 CLIPON W/TAB.75"
|
- | Board Level | Rectangular, Fins | 0.500" (12.70mm) | Clip and PC Pin | TO-220, TO-262 | 0.500" (12.70mm) | 1.0W @ 30°C | 7.00°C/W @ 400 LFM | 27.30°C/W | Black Anodized |