Package Cooled:
Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Descubre los productos 2
La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Type Width Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural
V8508A
ASSMANN WSW Components
9,919
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 19X12.80MM
Board Level 0.504" (12.80mm) TO-220 0.500" (12.70mm) 3.0W @ 60°C 14.00°C/W @ 200 LFM -
V5618B
ASSMANN WSW Components
1,169
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK ALUM ANOD
Top Mount 0.250" (6.35mm) 14-DIP and 16-DIP 0.189" (4.80mm) - - 46.00°C/W