- Length：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 31
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
17,584
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 VERT MNT W/TAB
|
- | Board Level, Vertical | Aluminum | Rectangular | 1.375" (34.93mm) | 0.860" (21.84mm) | Clip and PC Pin | TO-220 | 0.395" (10.03mm) | 2.5W @ 40°C | 6.00°C/W @ 400 LFM | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
9,074
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 CLIP-ON
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- | Board Level | Aluminum | Rectangular, Fins | 1.375" (34.93mm) | 0.860" (21.84mm) | Clip | TO-220 | 0.395" (10.03mm) | 2.5W @ 40°C | 6.00°C/W @ 400 LFM | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
9,408
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 CLIP-ON/TABS
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.375" (34.93mm) | 0.860" (21.84mm) | Clip and PC Pin | TO-220 | 0.395" (10.03mm) | 2.5W @ 40°C | 6.00°C/W @ 400 LFM | Black Anodized | ||
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ASSMANN WSW Components |
1,630
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM WITH PIN TO-220
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- | Board Level | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 0.504" (12.80mm) | PC Pin | TO-220 | 0.500" (12.70mm) | - | - | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
2,903
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/TAB BLACK
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.375" (34.93mm) | 0.860" (21.84mm) | Clip and PC Pin | TO-220 | 0.358" (9.10mm) | - | 11.00°C/W @ 200 LFM | Black Anodized | |||
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American Technical Ceramics |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR
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Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | Rectangular | 0.060" (1.52mm) | 0.030" (0.76mm) | SMD Pad | - | 0.020" (0.51mm) | - | - | - | ||
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American Technical Ceramics |
960
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR
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Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | Rectangular | 0.060" (1.52mm) | 0.030" (0.76mm) | SMD Pad | - | 0.020" (0.51mm) | - | - | - | ||
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American Technical Ceramics |
960
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR
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Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | Rectangular | 0.060" (1.52mm) | 0.030" (0.76mm) | SMD Pad | - | 0.020" (0.51mm) | - | - | - | ||
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ASSMANN WSW Components |
843
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.102" (27.99mm) | 0.728" (18.50mm) | Bolt On and Board Mounts | TO-220 | 0.590" (15.00mm) | - | - | Black Anodized | ||
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Apex Microtechnology |
12
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FOR DK AND HQ PACKAGES
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Apex Precision Power | Board Level | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 0.400" (10.16mm) | Bolt On | - | 0.400" (10.16mm) | - | - | - | ||
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ASSMANN WSW Components |
652
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.102" (27.99mm) | 0.728" (18.50mm) | Bolt On and Board Mounts | TO-220 | 0.590" (15.00mm) | - | - | Tin | ||
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American Technical Ceramics |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | Rectangular | 0.080" (2.03mm) | 0.050" (1.27mm) | SMD Pad | - | 0.025" (0.64mm) | - | - | - | ||
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American Technical Ceramics |
818
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | Rectangular | 0.080" (2.03mm) | 0.050" (1.27mm) | SMD Pad | - | 0.025" (0.64mm) | - | - | - | ||
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American Technical Ceramics |
818
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | Rectangular | 0.080" (2.03mm) | 0.050" (1.27mm) | SMD Pad | - | 0.025" (0.64mm) | - | - | - | ||
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ASSMANN WSW Components |
64
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK ANOD ALUM TO-220
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 0.504" (12.80mm) | PC Pin | TO-220 | 0.500" (12.70mm) | - | - | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 VERT MNT W/TAB
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.375" (34.93mm) | 0.860" (21.84mm) | Bolt On and PC Pin | TO-220 | 0.395" (10.03mm) | - | 11.00°C/W @ 200 LFM | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/TABS
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.375" (34.93mm) | 0.860" (21.84mm) | Bolt On and PC Pin | TO-220 | 0.395" (10.03mm) | - | 11.00°C/W @ 200 LFM | Black Anodized | |||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level | Aluminum | Rectangular, Fins | 0.620" (15.75mm) | 0.915" (23.24mm) | Clip | Multiwatt, SIP | 0.380" (9.65mm) | 1.5W @ 40°C | 6.00°C/W @ 600 LFM | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 VERT MNT W/TAB
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.375" (34.93mm) | 0.860" (21.84mm) | Clip and PC Pin | TO-220 | 0.395" (10.03mm) | 2.5W @ 40°C | 6.00°C/W @ 400 LFM | Black Anodized | ||
|
|
|
American Technical Ceramics |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | Rectangular | 0.040" (1.02mm) | 0.020" (0.51mm) | SMD Pad | - | 0.020" (0.51mm) | - | - | - |
