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- Type：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Advanced Thermal Solutions Inc. |
971
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220
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- | Board Level | 2.283" (58.00mm) | Bolt On | TO-220 | 0.059" (1.50mm) | 12.20°C/W @ 200 LFM | 21.00°C/W | |||
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|
Advanced Thermal Solutions Inc. |
74
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK 62MM X 52MM X 13MM
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maxiGRIP | Top Mount | 2.441" (62.00mm) | Clip | Flip Chip Processors | 0.512" (13.00mm) | 3.20°C/W @ 200 LFM | - | |||
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|
Advanced Thermal Solutions Inc. |
65
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 62MM X 52MM X 13MM
|
maxiGRIP | Top Mount | 2.441" (62.00mm) | Clip | Flip Chip Processors | 0.512" (13.00mm) | 3.20°C/W @ 200 LFM | - |
