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- Condiciones seleccionadas:
Descubre los productos 4
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Natural | Material Finish | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Natural | Material Finish | |
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ASSMANN WSW Components |
25,551
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ANOD ALUM CPU
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- | Top Mount | Aluminum | Square, Pin Fins | - | 0.275" (7.00mm) | 31.00°C/W | Black Anodized | ||
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t-Global Technology |
5,067
|
3 dias |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC BOARD 10X10X2MM
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XL-25 | Heat Spreader | Ceramic | Square | - | 0.079" (2.00mm) | - | - | ||
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t-Global Technology |
2,715
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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XL25 CERAMIC 10X10MM W/LI98C ADH
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XL-25 | Heat Spreader | Ceramic | Square | Thermal Tape, Adhesive (Included) | 0.089" (2.25mm) | - | - | ||
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t-Global Technology |
946
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
XL25 CERAMIC 10X10MM W/LI98C ADH
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XL-25 | Heat Spreader | Ceramic | Square | Thermal Tape, Adhesive (Included) | 0.085" (2.15mm) | - | - |
