Fabricante:
Material:
Package Cooled:
Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Material Finish:
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La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Type Material Shape Length Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
V-1100-SMD/B
ASSMANN WSW Components
18,400
3 dias
-
MOQ: 1  MPQ: 1
HEAT SINK ALUM DPAK TO-252
Top Mount Copper Rectangular, Fins 0.320" (8.13mm) SMD Pad D2Pak, TO-252 0.390" (9.91mm) - - 25.00°C/W Tin
V-1100-SMD/B
ASSMANN WSW Components
18,715
3 dias
-
MOQ: 1  MPQ: 1
HEAT SINK ALUM DPAK TO-252
Top Mount Copper Rectangular, Fins 0.320" (8.13mm) SMD Pad D2Pak, TO-252 0.390" (9.91mm) - - 25.00°C/W Tin
V-1100-SMD/B
ASSMANN WSW Components
18,715
3 dias
-
MOQ: 1  MPQ: 1
HEAT SINK ALUM DPAK TO-252
Top Mount Copper Rectangular, Fins 0.320" (8.13mm) SMD Pad D2Pak, TO-252 0.390" (9.91mm) - - 25.00°C/W Tin
V-1100-SMD/B-L
ASSMANN WSW Components
430
3 dias
-
MOQ: 1  MPQ: 1
HEAT SINK ALUM DPAK TO-252
Top Mount Copper Rectangular, Fins 0.320" (8.13mm) SMD Pad D2Pak, TO-252 0.390" (9.91mm) - - 25.00°C/W Tin
2286B
Aavid, Thermal Division of Boyd Corporation
Consulta
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
Board Level Aluminum Square 0.790" (20.07mm) Thermal Tape, Adhesive (Not Included) BGA 0.155" (3.94mm) 1.0W @ 40°C 20.00°C/W @ 200 LFM - Black Anodized