- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Ohmite |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-220 218 247 2.0"
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R | Board Level, Vertical | 1.654" (42.00mm) | 0.985" (25.00mm) | Bolt On and PC Pin | TO-218, TO-220, TO-247 | 2.000" (50.80mm) | 8.0W @ 40°C | 1.00°C/W @ 300 LFM | ||
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ASSMANN WSW Components |
450
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level, Vertical | 2.500" (63.50mm) | 1.638" (41.60mm) | Bolt On and PC Pin | SOT-32, TO-220, TOP-3 | 0.984" (25.00mm) | - | - | ||
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Wakefield-Vette |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK PWR NO MNT HOLES BLK
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623 | Board Level | 3.000" (76.20mm) | 4.750" (120.65mm) | Press Fit | TO-3 | 0.461" (11.70mm) | 15.0W @ 52°C | 1.50°C/W @ 250 LFM |
