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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Wakefield-Vette |
Consulta
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MOQ: 1 MPQ: 1
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HEATSINK
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231 | Board Level, Vertical | Rectangular, Fins | 0.690" (17.53mm) | 0.835" (21.21mm) | Bolt On and PC Pin | 0.400" (10.16mm) | 2.0W @ 45°C | 8.00°C/W @ 400 LFM | - | |||
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Wakefield-Vette |
Consulta
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 CLIP-ON BLK
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243 | Board Level | Square | 0.800" (20.32mm) | 0.270" (6.86mm) | Clip | 0.800" (20.32mm) | 2.0W @ 78°C | 8.20°C/W @ 400 LFM | 39.00°C/W |
