Descubre los productos 3
La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Series Type Material Shape Length Width Attachment Method Package Cooled Height Off Base (Height of Fin) Thermal Resistance @ Forced Air Flow Material Finish
BDN18-6CB/A01
CTS Thermal Management Products
377
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK CPU W/ADHESIVE 1.81"SQ
BDN Top Mount Aluminum Square, Pin Fins 1.810" (45.97mm) 1.810" (45.97mm) Thermal Tape, Adhesive (Included) Assorted (BGA, LGA, CPU, ASIC...) 0.605" (15.37mm) 2.80°C/W @ 400 LFM Black Anodized
CR301-25VE
Ohmite
24
3 dias
-
MOQ: 1  MPQ: 1
ALUMINUM HEATSINK 25MM DEGREASED
CR Board Level, Vertical Aluminum Alloy Rectangular, Fins 0.984" (25.00mm) 2.362" (60.00mm) 2 Clips and PC Pin TO-301 - - Degreased
CR301-25AE
Ohmite
24
3 dias
-
MOQ: 1  MPQ: 1
ALUMINUM HEATSINK 25MM BLK ANODI
CR Board Level, Vertical Aluminum Alloy Rectangular, Fins 0.984" (25.00mm) 2.362" (60.00mm) 2 Clips and PC Pin TO-301 - - Black Anodized