- Material:
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- Attachment Method:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Thermal Resistance @ Forced Air Flow:
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- Material Finish:
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- Condiciones seleccionadas:
Descubre los productos 3
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Material Finish | ||
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Material Finish | ||
CTS Thermal Management Products |
377
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.81"SQ
|
BDN | Top Mount | Aluminum | Square, Pin Fins | 1.810" (45.97mm) | 1.810" (45.97mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.605" (15.37mm) | 2.80°C/W @ 400 LFM | Black Anodized | ||||
Ohmite |
24
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
ALUMINUM HEATSINK 25MM DEGREASED
|
CR | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 0.984" (25.00mm) | 2.362" (60.00mm) | 2 Clips and PC Pin | TO-301 | - | - | Degreased | ||||
Ohmite |
24
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
ALUMINUM HEATSINK 25MM BLK ANODI
|
CR | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 0.984" (25.00mm) | 2.362" (60.00mm) | 2 Clips and PC Pin | TO-301 | - | - | Black Anodized |