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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Wakefield-Vette |
997
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3 dias |
-
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MOQ: 1 MPQ: 1
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ANCHOR HEATSINK 35X35X12.5MM
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Wave 3x | Board Level | Square, Angled Fins | 1.378" (35.00mm) | 1.378" (35.00mm) | Clip | BGA | 0.492" (12.50mm) | - | - | ||
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CUI Inc. |
Consulta
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-218, 31
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HSE | Board Level, Vertical | Rectangular, Fins | 1.250" (31.75mm) | 1.638" (41.60mm) | PC Pin | TO-218 | 0.984" (25.00mm) | 9.8W @ 75°C | 7.65°C/W |
