- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Wakefield-Vette |
881
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK 40X40X12MM PIN
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910 | Top Mount | Square, Pin Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | Clip | BGA | 0.457" (11.60mm) | - | 2.80°C/W @ 200 LFM | ||
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Wakefield-Vette |
Consulta
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-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 VERT MT BLK 2"
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637 | Board Level, Vertical | Rectangular, Fins | 2.000" (50.80mm) | 1.375" (34.93mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 6.0W @ 55°C | 4.70°C/W @ 200 LFM |
