- Width：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
7,556
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3 dias |
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MOQ: 1 MPQ: 1
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HEATSINK TO-92 .72" BLK
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Board Level, Vertical | Rectangular, Fins | 0.602" (15.29mm) | - | Press Fit | TO-92 | 0.3W @ 20°C | 17.50°C/W @ 400 LFM | 60.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Square, Fins | 1.780" (45.21mm) | 1.780" (45.21mm) | Bolt On | TO-220 (Dual) | 3.0W @ 30°C | 3.00°C/W @ 300 LFM | 8.70°C/W |
