- Material：
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- Length：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 11
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Material | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Material | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
3,782
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3 dias |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEATSINK .375"TO-220
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Board Level, Vertical | Copper | 1.100" (27.94mm) | Clip and PC Pin | TO-220 | 0.375" (9.52mm) | 1.5W @ 40°C | 10.00°C/W @ 200 LFM | 19.20°C/W | Tin | ||
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ASSMANN WSW Components |
981
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK BLK ANOD ALUM TO-220
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Board Level | Aluminum | 0.748" (19.00mm) | Bolt On | TO-220 | 0.433" (11.00mm) | - | - | 30.00°C/W | Black Anodized | ||
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ASSMANN WSW Components |
305
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK BLK ANOD ALUM TO-220
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Board Level | Aluminum | 0.748" (19.00mm) | Bolt On | TO-220 | 0.748" (19.00mm) | - | - | 22.00°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
994
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 W/TAB
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Board Level, Vertical | Aluminum | 0.945" (24.00mm) | Clip and Board Mounts | TO-220 | 0.433" (11.00mm) | - | 15.00°C/W @ 200 LFM | 17.30°C/W | Black Anodized | |||
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Advanced Thermal Solutions Inc. |
981
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 BLACK
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Board Level | Aluminum | 0.748" (19.00mm) | - | TO-220 | 0.433" (11.00mm) | - | 11.20°C/W @ 200 LFM | 23.70°C/W | Black Anodized | |||
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Advanced Thermal Solutions Inc. |
983
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 ALUMINUM
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Board Level, Vertical | Aluminum | 0.748" (19.00mm) | PC Pin | TO-220 | 0.433" (11.00mm) | - | 11.20°C/W @ 200 LFM | 23.70°C/W | Black Anodized | |||
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CUI Inc. |
488
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 4.1W ALUMINUM
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Board Level, Vertical | Aluminum | 0.441" (11.20mm) | PC Pin | TO-220 | 0.626" (15.90mm) | 4.1W @ 75°C | 6.50°C/W @ 200 LFM | 18.34°C/W | Black Anodized | ||
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CUI Inc. |
486
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 4.1W ALUMINUM
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Board Level | Aluminum | 0.625" (15.90mm) | - | TO-220 | 0.440" (11.18mm) | 4.1W @ 75°C | 6.50°C/W @ 200 LFM | 18.34°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
87
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-126 BLACK
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Board Level | Aluminum | 0.748" (19.00mm) | Bolt On | TO-126 | 0.748" (19.00mm) | 3.0W @ 65°C | 12.00°C/W @ 300 LFM | 21.60°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Copper | 1.040" (26.42mm) | Clip | TO-220 | 0.375" (9.52mm) | 3.5W @ 70°C | 7.00°C/W @ 500 LFM | 19.20°C/W | Tin | ||
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Comair Rotron |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 9.5X22X28MM
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Board Level, Vertical | Copper | 1.100" (27.94mm) | Clip and PC Pin | TO-220 | 0.375" (9.52mm) | 1.5W @ 40°C | 8.00°C/W @ 400 LFM | - | Tin |
