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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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CTS Thermal Management Products |
Consulta
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MOQ: 1 MPQ: 1
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HEATSINK CAP .500"H BLACK O-3
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7 | Rhombus | 1.062" (26.97mm) | Bolt On | TO-3 | 0.500" (12.70mm) | 2.0W @ 70°C | - | 40.00°C/W | ||
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CTS Thermal Management Products |
Consulta
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MOQ: 1 MPQ: 1
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HEATSINK FORGED 40X40X12MM
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APR | Square, Pin Fins | 1.560" (39.62mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | 2.80°C/W @ 200 LFM | - | ||
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CTS Thermal Management Products |
Consulta
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MOQ: 1 MPQ: 1
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HEATSINK FORGED W/ADHESIVE TAPE
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APR | Square, Pin Fins | 1.560" (39.62mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | 2.80°C/W @ 200 LFM | - |
