- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Advanced Thermal Solutions Inc. |
943
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 W/TAB BLACK
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- | Board Level, Vertical | Rectangular, Fins | 1.657" (42.10mm) | 2.010" (51.00mm) | Bolt On and Board Locks | TO-220 | 0.728" (18.50mm) | - | 1.80°C/W @ 200 LFM | |||
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Wakefield-Vette |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK MULTIWATT 2.0" BLK
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677 | Board Level, Vertical | Rectangular, Fins | 2.000" (50.80mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-218, TO-220, TO-247, Multiwatt | 1.000" (25.40mm) | 6.0W @ 40°C | 2.50°C/W @ 200 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Top Mount | Rectangular, Pin Fins | 1.810" (45.97mm) | 1.810" (45.97mm) | Bolt On | TO-3 | 0.750" (19.05mm) | 5.0W @ 40°C | 1.50°C/W @ 200 LFM |
