Descubre los productos 5
La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Series Type Shape Length Width Diameter Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Natural
624-25ABT4E
Wakefield-Vette
17,584
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK CPU 21MM SQ W/DBL TAPE
624 Top Mount Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - Thermal Tape, Adhesive (Included) BGA 0.250" (6.35mm) - -
322605B00000G
Aavid, Thermal Division of Boyd Corporation
2,876
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-5 1.25W H=.25" BLK
- Top Mount Cylindrical - - 0.315" (8.00mm) ID, 0.750" (19.05mm) OD Press Fit TO-5 0.250" (6.35mm) 1.0W @ 60°C 54.00°C/W
ATS-PCBT1075
Advanced Thermal Solutions Inc.
586
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-126 BLACK
- Board Level Rectangular, Fins 0.520" (13.21mm) 0.775" (19.68mm) - Bolt On TO-126 0.319" (8.10mm) - 35.80°C/W
321127B00000
Aavid, Thermal Division of Boyd Corporation
Consulta
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
- Top Mount Cylindrical - - 0.625" (15.88mm) OD Threaded Coupling TO-5 - 1.4W @ 70°C 54.00°C/W
624-25ABT4
Wakefield-Vette
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK CPU 21MM SQ W/DBL TAPE
624 Top Mount Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - Thermal Tape, Adhesive (Included) BGA 0.250" (6.35mm) - -