- Length：
-
- Width：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Wakefield-Vette |
17,584
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 21MM SQ W/DBL TAPE
|
624 | Square, Pin Fins | 0.827" (21.00mm) | 0.827" (21.00mm) | - | Thermal Tape, Adhesive (Included) | BGA | - | - | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
2,876
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-5 1.25W H=.25" BLK
|
- | Cylindrical | - | - | 0.315" (8.00mm) ID, 0.750" (19.05mm) OD | Press Fit | TO-5 | 1.0W @ 60°C | 54.00°C/W | ||
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Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 21MM SQ W/DBL TAPE
|
624 | Square, Pin Fins | 0.827" (21.00mm) | 0.827" (21.00mm) | - | Thermal Tape, Adhesive (Included) | BGA | - | - |
