- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Diameter | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Diameter | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | |
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Aavid, Thermal Division of Boyd Corporation |
2,876
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-5 1.25W H=.25" BLK
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0.315" (8.00mm) ID, 0.750" (19.05mm) OD | Press Fit | 0.250" (6.35mm) | 1.0W @ 60°C | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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0.625" (15.88mm) OD | Threaded Coupling | - | 1.4W @ 70°C |
