- Type:
-
- Attachment Method:
-
- Package Cooled:
-
- Height Off Base (Height of Fin):
-
- Thermal Resistance @ Natural:
-
Descubre los productos 3
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Natural | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Natural | ||
Wakefield-Vette |
17,584
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 21MM SQ W/DBL TAPE
|
624 | Top Mount | Square, Pin Fins | 0.827" (21.00mm) | 0.827" (21.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.250" (6.35mm) | - | ||||
Advanced Thermal Solutions Inc. |
586
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-126 BLACK
|
- | Board Level | Rectangular, Fins | 0.520" (13.21mm) | 0.775" (19.68mm) | Bolt On | TO-126 | 0.319" (8.10mm) | 35.80°C/W | ||||
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 21MM SQ W/DBL TAPE
|
624 | Top Mount | Square, Pin Fins | 0.827" (21.00mm) | 0.827" (21.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.250" (6.35mm) | - |