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Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Wakefield-Vette |
7,342
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 CLIP-ON BLK
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235 | Board Level | Rectangular, Fins | 0.850" (21.59mm) | 1.000" (25.40mm) | Bolt On | TO-220 | 0.500" (12.70mm) | 2.0W @ 40°C | 20.00°C/W | ||
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CTS Thermal Management Products |
192
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU W/ADHESIVE 1.21"SQ
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BDN | Top Mount | Square, Pin Fins | 1.210" (30.73mm) | 1.210" (30.73mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 19.60°C/W |
