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- Length：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 28
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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ASSMANN WSW Components |
18,400
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK ALUM DPAK TO-252
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- | Top Mount | Copper | Rectangular, Fins | 0.320" (8.13mm) | 0.790" (20.07mm) | SMD Pad | D2Pak, TO-252 | 0.390" (9.91mm) | - | - | Tin | ||
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ASSMANN WSW Components |
18,715
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK ALUM DPAK TO-252
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- | Top Mount | Copper | Rectangular, Fins | 0.320" (8.13mm) | 0.790" (20.07mm) | SMD Pad | D2Pak, TO-252 | 0.390" (9.91mm) | - | - | Tin | ||
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ASSMANN WSW Components |
18,715
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK ALUM DPAK TO-252
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- | Top Mount | Copper | Rectangular, Fins | 0.320" (8.13mm) | 0.790" (20.07mm) | SMD Pad | D2Pak, TO-252 | 0.390" (9.91mm) | - | - | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
5,395
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 CLIP-ON BLACK
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.700" (17.78mm) | 0.520" (13.21mm) | Clip | TO-220 | 0.510" (12.95mm) | 2.0W @ 50°C | 12.00°C/W @ 300 LFM | Black Anodized | ||
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Wakefield-Vette |
22,064
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK LOW HEIGHT BLK TO-220
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274 | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | 0.520" (13.21mm) | Bolt On | TO-220 | 0.500" (12.70mm) | 2.0W @ 50°C | 7.00°C/W @ 400 LFM | Black Anodized | ||
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Wakefield-Vette |
13,477
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 VERT/HORZ BLK
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289 | Board Level | Aluminum | Rectangular, Fins | 0.710" (18.03mm) | 1.000" (25.40mm) | Bolt On | TO-218, TO-202, TO-220 | 0.500" (12.70mm) | 2.0W @ 50°C | 9.00°C/W @ 400 LFM | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
7,914
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3 dias |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEATSINK .375"TO-220
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- | Board Level | Aluminum | Rectangular, Fins | 0.700" (17.78mm) | 0.900" (22.86mm) | Clip | TO-220 | 0.375" (9.52mm) | 2.0W @ 50°C | 14.00°C/W @ 200 LFM | Black Anodized | ||
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ASSMANN WSW Components |
3,495
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level | Aluminum | Rectangular, Fins | 0.712" (18.08mm) | 1.000" (25.40mm) | Bolt On | TO-220 | 0.311" (7.90mm) | - | - | Black Anodized | ||
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ASSMANN WSW Components |
430
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK ALUM DPAK TO-252
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- | Top Mount | Copper | Rectangular, Fins | 0.320" (8.13mm) | 0.790" (20.07mm) | SMD Pad | D2Pak, TO-252 | 0.390" (9.91mm) | - | - | Tin | ||
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Advanced Thermal Solutions Inc. |
970
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 STEEL W/TAB
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- | Board Level, Vertical | Steel | Rectangular | 0.787" (20.00mm) | 1.220" (30.99mm) | PC Pin | TO-220 | 0.032" (0.80mm) | - | 13.00°C/W @ 200 LFM | Tin | |||
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American Technical Ceramics |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR Q-BRIDGE
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | Rectangular | 0.040" (1.02mm) | 0.020" (0.51mm) | SMD Pad | - | 0.020" (0.51mm) | - | - | - | ||
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American Technical Ceramics |
320
|
3 dias |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR Q-BRIDGE
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | Rectangular | 0.040" (1.02mm) | 0.020" (0.51mm) | SMD Pad | - | 0.020" (0.51mm) | - | - | - | ||
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American Technical Ceramics |
320
|
3 dias |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR Q-BRIDGE
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | Rectangular | 0.040" (1.02mm) | 0.020" (0.51mm) | SMD Pad | - | 0.020" (0.51mm) | - | - | - | ||
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American Technical Ceramics |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | Rectangular | 0.040" (1.02mm) | 0.020" (0.51mm) | SMD Pad | - | 0.020" (0.51mm) | - | - | - | ||
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American Technical Ceramics |
65
|
3 dias |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | Rectangular | 0.040" (1.02mm) | 0.020" (0.51mm) | SMD Pad | - | 0.020" (0.51mm) | - | - | - | ||
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American Technical Ceramics |
65
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR
|
Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | Rectangular | 0.040" (1.02mm) | 0.020" (0.51mm) | SMD Pad | - | 0.020" (0.51mm) | - | - | - | ||
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American Technical Ceramics |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | Rectangular | 0.060" (1.52mm) | 0.030" (0.76mm) | SMD Pad | - | 0.020" (0.51mm) | - | - | - | ||
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American Technical Ceramics |
737
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR
|
Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | Rectangular | 0.060" (1.52mm) | 0.030" (0.76mm) | SMD Pad | - | 0.020" (0.51mm) | - | - | - | ||
|
|
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American Technical Ceramics |
737
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR
|
Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | Rectangular | 0.060" (1.52mm) | 0.030" (0.76mm) | SMD Pad | - | 0.020" (0.51mm) | - | - | - | ||
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Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
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HEATSINK LOW PRO BLACK TO-220
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- | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | 0.520" (13.21mm) | Bolt On | TO-220 | 0.500" (12.70mm) | - | 10.20°C/W @ 200 LFM | Black Anodized |
