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- Material:
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- Length:
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- Width:
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- Attachment Method:
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- Package Cooled:
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- Thermal Resistance @ Natural:
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- Condiciones seleccionadas:
Descubre los productos 8
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
Aavid, Thermal Division of Boyd Corporation |
117
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
COPPER HEATSINK 57.9X59X11MM
|
- | Top Mount | Copper | Rectangular, Fins | 2.323" (59.00mm) | 2.280" (57.91mm) | Push Pin | BGA | 1.90°C/W @ 200 LFM | 7.70°C/W | AavSHIELD 3C | ||||
ASSMANN WSW Components |
981
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK BLK ANOD ALUM TO-220
|
- | Board Level | Aluminum | Rectangular, Fins | 0.748" (19.00mm) | 0.866" (22.00mm) | Bolt On | TO-220 | - | 30.00°C/W | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
994
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/TAB
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.945" (24.00mm) | 0.866" (22.00mm) | Clip and Board Mounts | TO-220 | 15.00°C/W @ 200 LFM | 17.30°C/W | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
981
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 BLACK
|
- | Board Level | Aluminum | Rectangular, Fins | 0.748" (19.00mm) | 0.866" (22.00mm) | - | TO-220 | 11.20°C/W @ 200 LFM | 23.70°C/W | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
983
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 ALUMINUM
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.748" (19.00mm) | 0.866" (22.00mm) | PC Pin | TO-220 | 11.20°C/W @ 200 LFM | 23.70°C/W | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
66
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 29MM X 37MM X 11MM
|
maxiGRIP | Top Mount | Aluminum | Rectangular, Angled Fins | 1.457" (37.00mm) | 1.142" (29.01mm) | Clip | Flip Chip Processors | 6.20°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
94
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 28MM X 45MM X 11MM
|
maxiGRIP | Top Mount | Aluminum | Rectangular, Angled Fins | 1.772" (45.00mm) | 1.102" (28.00mm) | Clip | Flip Chip Processors | 4.50°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 BLACK
|
- | Board Level | Aluminum | Rectangular, Angled Fins | 0.748" (19.00mm) | 0.787" (20.00mm) | Bolt On | TO-220 | 20.00°C/W @ 200 LFM | 30.00°C/W | Black Anodized |