- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Aavid, Thermal Division of Boyd Corporation |
3,215
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3 dias |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEATSINK .515"TO-220
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0.848" (21.55mm) | Clip and PC Pin | 0.515" (13.08mm) | 1.0W @ 30°C | 6.00°C/W @ 500 LFM | ||
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Advanced Thermal Solutions Inc. |
983
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 COPPER W/TAB
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0.858" (21.80mm) | Clip and Board Mounts | 0.510" (12.95mm) | - | 8.00°C/W @ 200 LFM |
