- Type:
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- Material:
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- Attachment Method:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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- Condiciones seleccionadas:
Descubre los productos 4
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
Wakefield-Vette |
8,135
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 BOLT-ON BLK
|
291 | Board Level | Aluminum | Rectangular, Fins | 0.860" (21.84mm) | 1.000" (25.40mm) | Bolt On | TO-220 | 2.0W @ 68°C | 16.00°C/W @ 600 LFM | 34.00°C/W | Black Anodized | ||||
Wakefield-Vette |
927
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK DPAK SMT TIN PLATED
|
217 | Top Mount | Copper | Rectangular, Fins | 0.740" (18.80mm) | 0.600" (15.24mm) | SMD Pad | D2Pak (TO-263), SOL-20, SOT-223, TO-220 | 1.0W @ 55°C | 16.00°C/W @ 200 LFM | 55.00°C/W | Tin | ||||
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINKS
|
217 | Top Mount | Copper | Rectangular, Fins | 0.740" (18.80mm) | 0.600" (15.24mm) | SMD Pad | D2Pak (TO-263), SOL-20, SOT-223, TO-220 | 1.0W @ 55°C | 16.00°C/W @ 200 LFM | 55.00°C/W | Tin | ||||
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK DPAK SMT TIN PLATED
|
217 | Top Mount | Copper | Rectangular | 0.740" (18.80mm) | 0.600" (15.24mm) | SMD Pad | D2Pak (TO-263), SOL-20, SOT-223, TO-220 | 1.0W @ 55°C | 16.00°C/W @ 200 LFM | 55.00°C/W | Tin |