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- Material：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 6
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
6,500
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220
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Top Mount | Copper | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | SMD Pad | TO-263 (D2Pak) | 0.450" (11.43mm) | 2.0W @ 30°C | 11.00°C/W | Tin | ||
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|
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Aavid, Thermal Division of Boyd Corporation |
6,648
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220
|
Top Mount | Copper | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | SMD Pad | TO-263 (D2Pak) | 0.450" (11.43mm) | 2.0W @ 30°C | 11.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
6,648
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220
|
Top Mount | Copper | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | SMD Pad | TO-263 (D2Pak) | 0.450" (11.43mm) | 2.0W @ 30°C | 11.00°C/W | Tin | ||
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|
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Aavid, Thermal Division of Boyd Corporation |
12,216
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
TOP MOUNT HEATSINK .45" D2PAK
|
Top Mount | Copper | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | SMD Pad | TO-263 (D2Pak) | 0.450" (11.43mm) | 2.0W @ 30°C | 11.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Aluminum | Square, Fins | 1.780" (45.21mm) | 1.780" (45.21mm) | Bolt On | TO-220 (Dual) | 0.720" (18.29mm) | 3.0W @ 30°C | 8.70°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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Board Level | Aluminum | Rhombus | 1.630" (41.40mm) | 1.290" (32.77mm) | Bolt On | TO-3 | 1.250" (31.75mm) | 7.0W @ 70°C | 9.80°C/W | Black Anodized |
