- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Condiciones seleccionadas:
Descubre los productos 4
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Aavid, Thermal Division of Boyd Corporation |
5,947
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3 dias |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEATSINK 1.95" TO220
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- | Board Level, Vertical | Rectangular, Fins | 1.950" (49.53mm) | 1.900" (48.26mm) | Bolt On and PC Pin | TO-220 | 0.950" (24.13mm) | 3.0W @ 20°C | 2.50°C/W @ 400 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 PIN BLACK
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- | Board Level, Vertical | Rectangular, Fins | 1.500" (38.10mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-220 | 1.000" (25.40mm) | 4.0W @ 30°C | 2.00°C/W @ 400 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level, Vertical | Rectangular, Fins | 1.950" (49.53mm) | 1.900" (48.26mm) | Bolt On and PC Pin | TO-220 | 0.950" (24.13mm) | 5.0W @ 30°C | 2.50°C/W @ 400 LFM | ||
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CTS Thermal Management Products |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK PWR 1.0"H BLACK TO-3
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HP3 | Board Level | Square, Pin Fins | 3.120" (79.25mm) | 3.120" (79.25mm) | Bolt On | TO-3 | 1.000" (25.40mm) | - | - |
