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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 20
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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ASSMANN WSW Components |
1,562
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ANOD ALUM W/PIN TO-220
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.984" (25.00mm) | Bolt On | TO-220 | 0.787" (19.99mm) | - | - | 10.00°C/W | Black Anodized | ||
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|
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ASSMANN WSW Components |
1,944
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD W/PIN TO-220
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.984" (25.00mm) | Bolt On and PC Pin | TO-220 | 0.551" (14.00mm) | - | - | 12.50°C/W | Black Anodized | ||
|
|
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ASSMANN WSW Components |
2,177
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD W/PIN TO-220
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.969" (50.00mm) | Bolt On and PC Pin | TO-220 | 0.551" (14.00mm) | - | - | 8.50°C/W | Black Anodized | ||
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Wakefield-Vette |
993
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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ANCHOR HEATSINK 32X32X12MM
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Wave 3x | Board Level | Aluminum Alloy | Square, Angled Fins | 1.260" (32.00mm) | Clip | BGA | 0.472" (12.00mm) | - | 4.64°C/W @ 200 LFM | - | Black Anodized | ||
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|
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ASSMANN WSW Components |
821
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ANOD ALUM W/PIN TO-220
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.476" (37.50mm) | Bolt On | TO-220 | 0.787" (19.99mm) | - | - | 8.00°C/W | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
154
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD TO-220
|
- | Board Level | Aluminum | Rectangular, Fins | 1.181" (30.00mm) | Bolt On | TO-220 | 0.787" (19.99mm) | - | - | 8.00°C/W | Black Anodized | ||
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t-Global Technology |
264
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CER 32X32X6MM W/TAPE
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- | Heat Spreader | Ceramic | Square, Fins | 1.260" (32.00mm) | Thermal Tape, Adhesive (Included) | - | 0.236" (6.00mm) | - | - | - | - | ||
|
|
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ASSMANN WSW Components |
295
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Top Mount | Aluminum | Rectangular, Fins | 1.181" (30.00mm) | Bolt On | TO-220 | 0.551" (14.00mm) | - | - | - | Black Anodized | ||
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CUI Inc. |
424
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 25
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HSE | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 1.000" (25.40mm) | PC Pin | TO-220 | 0.551" (14.00mm) | 5.7W @ 75°C | 7.74°C/W @ 200 LFM | 13.16°C/W | Black Anodized | ||
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|
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t-Global Technology |
156
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CER 32X32X6MM
|
- | Heat Spreader | Ceramic | Square, Fins | 1.260" (32.00mm) | - | - | 0.236" (6.00mm) | - | - | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
23
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
65245 EXTRUSION 1.65X1.26"X4
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- | Top Mount | Aluminum | Rectangular, Pin Fins | 48.000" (1219.20mm) | Adhesive | - | 1.650" (41.91mm) | - | 2.00°C/W @ 300 LFM | - | - | ||
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Advanced Thermal Solutions Inc. |
98
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
SUPERGRIP HEATSINK 32X32X7.5MM
|
superGRIP | Top Mount | Aluminum | Square, Fins | 1.260" (32.00mm) | Clip, Thermal Material | BGA | 0.295" (7.50mm) | - | 11.30°C/W @ 200 LFM | - | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
100
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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SUPERGRIP HEATSINK 32X32X7.5MM
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maxiFLOW, superGRIP | Top Mount | Aluminum | Square, Angled Fins | 1.260" (32.00mm) | Clip, Thermal Material | BGA | 0.295" (7.50mm) | - | 5.90°C/W @ 200 LFM | - | Blue Anodized | |||
|
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Advanced Thermal Solutions Inc. |
100
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
SUPERGRIP HEATSINK 32X32X12.5MM
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superGRIP | Top Mount | Aluminum | Square, Fins | 1.260" (32.00mm) | Clip, Thermal Material | BGA | 0.492" (12.50mm) | - | 5.90°C/W @ 200 LFM | - | Blue Anodized | |||
|
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Advanced Thermal Solutions Inc. |
100
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
SUPERGRIP HEATSINK 32X32X12.5MM
|
maxiFLOW, superGRIP | Top Mount | Aluminum | Square, Angled Fins | 1.260" (32.00mm) | Clip, Thermal Material | BGA | 0.492" (12.50mm) | - | 3.50°C/W @ 200 LFM | - | Blue Anodized | |||
|
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Advanced Thermal Solutions Inc. |
99
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
SUPERGRIP HEATSINK 32X32X17.5MM
|
superGRIP | Top Mount | Aluminum | Square, Fins | 1.260" (32.00mm) | Clip, Thermal Material | BGA | 0.689" (17.50mm) | - | 4.10°C/W @ 200 LFM | - | Blue Anodized | |||
|
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Advanced Thermal Solutions Inc. |
100
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
SUPERGRIP HEATSINK 32X32X17.5MM
|
maxiFLOW, superGRIP | Top Mount | Aluminum | Square, Angled Fins | 1.260" (32.00mm) | Clip, Thermal Material | BGA | 0.689" (17.50mm) | - | 2.70°C/W @ 200 LFM | - | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
87
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 32MM X 13MM
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maxiGRIP | Top Mount | Aluminum | Rectangular, Angled Fins | 0.984" (25.00mm) | Clip | Flip Chip Processors | 0.512" (13.00mm) | - | 6.50°C/W @ 200 LFM | - | Black Anodized | |||
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ASSMANN WSW Components |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD W/PIN TO-220
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.476" (37.50mm) | Bolt On and PC Pin | TO-220 | 0.551" (14.00mm) | - | - | 10.00°C/W | Black Anodized | ||
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|
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CUI Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION,TO-220, 38.
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HSE | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 1.500" (38.10mm) | PC Pin | TO-220 | 0.551" (14.00mm) | 6.5W @ 75°C | 3.62°C/W @ 200 LFM | 11.54°C/W | Black Anodized |
